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Soldering Fluid

  • Product Name: Soldering Fluid

  • Viscosity: 110 (Pa.S)

  • Alloy composition: rosin-activator-thixotropic agent-resin, etc

  • Ignition point: 120-250°C

  • Operating temperature: 140–270 (°C)

  • Specifications: T25-0 Fluorine – Transparent Paste – 100g, T25-0 Fluoro – Transparent Paste – 30g per pack, T25-0 Fluoride – Transparent Pourable – 10g per pack, S20-(Diluted Tin Flux) – 0 Fluorine – 100g

  • Customization: Can be customized

  • Scope of Use: PCBA Production – Repair of Motherboards – Dilution of Soldering Paste



Description

Natural resin. Easy to clean. Pure natural rosin resin. Easily cleans away residues after welding. Does not whiten or corrode. High reactivity. Suitable for BGA and QFN repairs.

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Affordable price, excellent welding performance, highly adaptable, suitable for use as a flux for large-scale products.

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Zero residue, minimal residual content, excellent wetting properties, strong adhesion. The creamy white paste is suitable for diluting solder paste (as an alternative to a diluent).

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